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Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...
Business Wire

Onto Innovation Announces Opening of Packaging Applications Center of Excellence

Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D WILMINGTON, Mass.--(BUSINESS WIRE)--Onto ...
Semiconductor Engineering

The Rise Of Panel-Level Packaging

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...