Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates.

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

TOKYO--(BUSINESS WIRE)--USHIO INC., (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that the company installed one unit of a projection aligner dedicated to developing 2.5D glass ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce ...

LONDON — Allvia Inc., which bills itself as the world's first through-silicon via (TSV) foundry, has announced it has integrated embedded capacitors on silicon interposer substrates. Capacitance ...

TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS ...

Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform was ...