New white paper available, Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems ...

While semiconductor die get so much of the attention due to their ever-shrinking feature size and ever-increasing substrate size, the ability to effectively package them and thus use them in a circuit ...

Power devices continue to evolve rapidly as SiC and GaN technologies become more highly integrated, easy to use, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes ...

KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei’s (TOKYO:7282) technology to enhance GaN substrates has been verified to improve power device performance. An article confirming it was published in ...

Based on the table, the company’s segment groups consist of Mature Process Technology, Memory, Advanced Logic and Aftermarket. Starting with the Mature Process Technology, which is broken down into ...

The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers—and they show no signs of slowing down. Today, the most advanced AI chips are bordered on ...