Pune, India, Nov. 07, 2023 (GLOBE NEWSWIRE) -- Advent of 5G network in global market created lucrative opportunity for the market player to develop new line of electronics devices, having ...

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

The system-on-chip (SoC) is arguably the biggest misnomer of today’s electronics industry. The core integrated circuit may well have onboard much of the logic circuitry needed to support the needs of ...

SANTA CRUZ, Calif. — Many tools support signal-integrity or power analysis for chips, packages or boards individually, but analyzing them all together is a challenge. Optimal Corp. this week will ...

This product is featured in EDN's Hot 100 products of 2016. See all 100 here. Editor's note: I absolutely love new and innovative analog products, especially when they enhance functionality, ...

Proponents of system-in-package (SIP) technology offer compelling arguments for the benefits of this approach to system-level design, chief among them the need for better time-to-market than that ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...