Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...

Part one of this series, published in the January 2007 issue, discussed how to use linear superposition in the steady-state analysis of multiple heat-source systems. However, linear superposition also ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Simulation only creates value when it delivers results that are both trustworthy and early enough to influence decisions. If ...

The semiconductor industry has witnessed rapid advancements in the pursuit of integrating more functionality into smaller footprints, pushing the boundaries of traditional two-dimensional integrated ...

Computational models and simulations have had an important role in engineering analysis since as far back as the 1960s. It is widely recognized that the use of modeling and simulation tools can make ...