Abstract: Large die size with high I/O density is the trend for IC product design, especially for 5G networking and AI products which need more function integration. How to decrease package warpage ...
Abstract: Pressureless low temperature Cu–Cu bonding by sintering Cu nanoparticle (NP) paste is a promising method to realize die attachment in power electronics and third-generation semiconductor ...
Deer numbers are declining in the preserve, which is concerning because they form an important part of the diet of local predators, like Florida panthers (Puma concolor coryi). To learn more about how ...
Department of Chemical and Petroleum Engineering, University of Calgary, Calgary, AB, T2N 1N4, Canada School of Engineering, University of British Columbia, Kelowna, BC, V1V 1V7, Canada Departments of ...
Since I tested the Nighthawk M3 last year, I've been impressed with the speed and power of that small device, and now the M7 Pro's reliability and strength of connection take another step up. As long ...
Pull requests help you collaborate on code with other people. As pull requests are created, they’ll appear here in a searchable and filterable list. To get started, you should create a pull request.
Our seasoned contributor saw the 2nd-gen Volkswagen T-Roc – due in Mzansi in the 2nd half of 2026 – at the IAA Mobility 2025 in Munich. Herewith his impressions… Cars.co.za recently reported that ...
International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu 300093, Taiwan ...
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